|Non Contact Instrument for Wafer Thickness and Wafer Topography Metrology
for (ZebraOptical CT-IR):
Tool is designed for wafers on grinding and dicing tape both patterned, and bumped, as
well as wafers mounted on sapphire and glass carriers.
CT-IR system profiling metrology for wafers from 50 - 300 mm and larger substrates.
Please contact us for detailed application notes at email@example.com.
Zebra CT-IR system uses patent pending infrared (IR) interferometric technique, which
provides accurate substrate thickness measurement and thickness variation (TTV) of
thick to ultra-thin wafers for in-situ grinding, etching and deposition applications. Most
of materials transparent in an IR beam, such as Si, GaAs, InP, SiC, Glass, Quartz and
many polymers are readily measured with standard spatial resolution of 50 microns
spot, (smaller spot sizes are available). Using a single probe system, substrate
thickness of conventional wafers with patterns, tapes, bumps or bonded wafers
mounted on carriers can be determined with high precision and accuracy.
The CT-IR sensor employs patent pending infrared (IR) interferometric technique,
which provides a direct and accurate substrate thickness measurement and thickness
variation (TTV) of thick to ultra-thin wafers for in-situ grinding, etching and deposition
applications. Various specialized applications including Membrane Thickness and
Bump Height metrologies applications have been developed. Other options available
include trench depth and via holes, including high aspect ratio trenches and vias in
MEMs type applications. Data can be exported in text format and analyzed by a third
party data analysis software packages such as SigmaPlot(TM), Excel (TM), or
MathCad (TM) *).
The CT-IR sensor is also offered coupled with other metrologies offered by Sunrise
Optical LLC as the Zebraoptical Integrated Metrology package.
*) SigmaPlot(TM) is a trademark of Systat Software, Inc., Excel (TM) is a trademark of Micorsoft Corporation, MathCad (TM)
is a trademark of Mathsoft Engineering & Education, Inc.
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Important Note: All product specifications are subject to change without
notice. For up to date product specifications please contact us directly
Thin Membrane Zebra Optoprofiler Metrology TM-1 unit
for measurements of thickness of thin Si membranes 2-30
1.System comprises of sensor unit and PC based controller, and
equipped with 1 (one) objective.
2.Fiber optic probe mounted on user sample stand