Non Contact Instrument for Wafer Thickness and Wafer
Topography Metrology for (ZebraOptical CT-IR):

  • MEMS
  • flexible electronics
  • bond wafer
  • and thin back-grind wafers
  • and chemically processed wafers
  • trench depth
  • membrane thickness
  • laser and LED profiling

Tool is designed for wafers on grinding and dicing tape
both patterned, and bumped, as well as wafers
mounted on sapphire and glass carriers.

CT-IR system profiling metrology for wafers from 50 -
300 mm and larger substrates.

Please contact us for detailed application notes at
sales@zebraoptical.com.

Zebra CT-IR system uses patent pending infrared (IR) interferometric
technique, which provides accurate substrate thickness measurement and
thickness variation (TTV) of thick to ultra-thin wafers for in-situ grinding,
etching and deposition applications. Most of materials transparent in an IR
beam, such as Si, GaAs, InP, SiC, Glass, Quartz and many polymers are
readily measured with standard spatial resolution of 50 microns spot,
(smaller spot sizes are available). Using a single probe system, substrate
thickness of conventional wafers with patterns, tapes, bumps or bonded
wafers mounted on carriers can be determined with high precision and
accuracy.

The CT-IR sensor employs patent pending infrared (IR) interferometric
technique, which provides a direct and accurate substrate thickness
measurement and thickness variation (TTV) of thick to ultra-thin wafers for in-
situ grinding, etching and deposition applications. Various specialized
applications including Membrane Thickness and Bump Height metrologies
applications have been developed. Other options available include trench
depth and via holes, including high aspect ratio trenches and vias in MEMs
type applications. Data can be exported in text format and analyzed by a third
party data analysis software packages such as SigmaPlot(TM),  Excel (TM),
or MathCad (TM) *).















The CT-IR sensor is also offered coupled with other metrologies offered by
Sunrise Optical LLC as the Zebraoptical Integrated Metrology package.   







*) SigmaPlot(TM) is a trademark of Systat Software, Inc., Excel (TM) is a trademark of Micorsoft Corporation, MathCad
(TM) is a trademark of Mathsoft Engineering & Education, Inc.
IP / Terms of use
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Important Note: All product specifications are subject to change without
notice. For up to date product specifications please contact us directly
headquarters.

Thin Membrane Zebra Optoprofiler Metrology TM-1 unit
for measurements of thickness of thin Si membranes 2-30
1.System comprises of sensor unit and PC based controller,
and equipped with 1 (one) objective.
2.Fiber optic probe mounted on user sample stand
3.Calibration sample
ZebraOptical Optoprofiler: Interferometric Probe
e-mail: sales@zebraoptical.com

Full contact information