| Non Contact Instrument for Wafer Thickness and Wafer Topography Metrology for (ZebraOptical CT-IR):
Tool is designed for wafers on grinding and dicing tape both patterned, and bumped, as well as wafers mounted on sapphire and glass carriers. CT-IR system profiling metrology for wafers from 50 - 300 mm and larger substrates. Please contact us for detailed application notes at sales@zebraoptical.com. Zebra CT-IR system uses patent pending infrared (IR) interferometric technique, which provides accurate substrate thickness measurement and thickness variation (TTV) of thick to ultra-thin wafers for in-situ grinding, etching and deposition applications. Most of materials transparent in an IR beam, such as Si, GaAs, InP, SiC, Glass, Quartz and many polymers are readily measured with standard spatial resolution of 50 microns spot, (smaller spot sizes are available). Using a single probe system, substrate thickness of conventional wafers with patterns, tapes, bumps or bonded wafers mounted on carriers can be determined with high precision and accuracy. The CT-IR sensor employs patent pending infrared (IR) interferometric technique, which provides a direct and accurate substrate thickness measurement and thickness variation (TTV) of thick to ultra-thin wafers for in- situ grinding, etching and deposition applications. Various specialized applications including Membrane Thickness and Bump Height metrologies applications have been developed. Other options available include trench depth and via holes, including high aspect ratio trenches and vias in MEMs type applications. Data can be exported in text format and analyzed by a third party data analysis software packages such as SigmaPlot(TM), Excel (TM), or MathCad (TM) *). The CT-IR sensor is also offered coupled with other metrologies offered by Sunrise Optical LLC as the Zebraoptical Integrated Metrology package. *) SigmaPlot(TM) is a trademark of Systat Software, Inc., Excel (TM) is a trademark of Micorsoft Corporation, MathCad (TM) is a trademark of Mathsoft Engineering & Education, Inc. |
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| and request our brochures and technical product information. Important Note: All product specifications are subject to change without notice. For up to date product specifications please contact us directly headquarters. |
Thin Membrane Zebra Optoprofiler Metrology TM-1 unit for measurements of thickness of thin Si membranes 2-30 1.System comprises of sensor unit and PC based controller, and equipped with 1 (one) objective. 2.Fiber optic probe mounted on user sample stand 3.Calibration sample |
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ZebraOptical Optoprofiler: Interferometric Probe